JPH0351973Y2 - - Google Patents
Info
- Publication number
- JPH0351973Y2 JPH0351973Y2 JP1984178245U JP17824584U JPH0351973Y2 JP H0351973 Y2 JPH0351973 Y2 JP H0351973Y2 JP 1984178245 U JP1984178245 U JP 1984178245U JP 17824584 U JP17824584 U JP 17824584U JP H0351973 Y2 JPH0351973 Y2 JP H0351973Y2
- Authority
- JP
- Japan
- Prior art keywords
- chute
- frame
- sliding table
- driven
- cam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984178245U JPH0351973Y2 (en]) | 1984-11-26 | 1984-11-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984178245U JPH0351973Y2 (en]) | 1984-11-26 | 1984-11-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6194346U JPS6194346U (en]) | 1986-06-18 |
JPH0351973Y2 true JPH0351973Y2 (en]) | 1991-11-08 |
Family
ID=30735812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984178245U Expired JPH0351973Y2 (en]) | 1984-11-26 | 1984-11-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0351973Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5460864A (en) * | 1977-10-24 | 1979-05-16 | Mitsubishi Electric Corp | Draw-out method for semiconductor device |
-
1984
- 1984-11-26 JP JP1984178245U patent/JPH0351973Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6194346U (en]) | 1986-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0794067B2 (ja) | プリント基板の保持搬送方法およびその装置 | |
US5264002A (en) | Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails | |
JPH0770550B2 (ja) | 半導体フレームの搬送装置および搬送方法 | |
JPS61500013A (ja) | 順送りプレスの絞り段へのブランクの供給装置 | |
JP3075456B2 (ja) | プレス加工におけるプレートの送り方法及びその機構 | |
CN109382655B (zh) | 一种角磨机的机身装配生产线 | |
JPH0351973Y2 (en]) | ||
JPS63502736A (ja) | 製造装置 | |
KR0164254B1 (ko) | 반도체팩키지 싱귤레이션장치 | |
JPH0115199Y2 (en]) | ||
JP3800562B2 (ja) | 板材加工機のワーク搬出装置及びワーク搬出方法 | |
JP2549830B2 (ja) | パンチプレス | |
JPH0243532Y2 (en]) | ||
JP2669686B2 (ja) | 半導体装置のリード曲げ方法 | |
KR0172051B1 (ko) | P.l.c.c. 반도체 패키지의 리드포밍 장치 및 그 작업방법 | |
JPH0615387A (ja) | プレス装置 | |
JPH0328032Y2 (en]) | ||
JPS6377613A (ja) | 部品供給機構 | |
JP2961584B2 (ja) | 電子部品のベース部押え装置 | |
JP2878938B2 (ja) | 治具プレート着脱装置 | |
JPS6310189Y2 (en]) | ||
WO1991015332A1 (en) | Automatic work feeder of machine tool | |
JPH0144186Y2 (en]) | ||
JP5130881B2 (ja) | ワークの位置決め搬送装置 | |
JP2693277B2 (ja) | 電子部品用半田ディップ装置 |